Cov txheej txheem tseem ceeb rau kev txiav txim siab yog tias sintering tiav yog los soj ntsuam seb magnesium oxide nplej puas tau recrystallized los ntawm kev tshuaj ntsuam metallographic, ua ke nrog kub - lub xeev kuaj thiab X-ray nrhiav kom paub meej. The hallmark of complete sintering is significantly grown grains, densely arranged, forming a continuous ceramic structure.
1. Metallographic Analysis (Qhov Kev Txiav Txim Siab Tshaj Plaws)
Cov yam ntxwv tsim nyog:
Cov qoob loo loj hlob zoo nrog thaj tsam ntshiab, nthuav tawm cov yam ntxwv recrystallization; Cov qauv ntom ntom, tsis muaj qhov pom tseeb micropores lossis xoob hmoov thaj chaw; Sintering kub yuav tsum ncav cuag 800-1000 degree, nrog lub sij hawm tuav ntau tshaj los yog sib npaug rau 1 teev.
Cov yam ntxwv tsis tsim nyog:
Fine, xoob nplej, zoo li cov hmoov nyoos; Ntau lub micropores thiab qhov cuam tshuam tsis tu ncua yog pom nyob rau hauv lub tshuab ntsuas qhov ntsuas, qhia tias qhov kub tsis txaus sintering lossis luv luv lub sijhawm tuav.
Metallographic tsom xam yog tus qauv kub rau kev txiav txim siab "tseeb sintering," ncaj qha cuam tshuam txog cov txheej txheem sab hauv ntawm cov khoom.
2. Kub-Kev Tshawb Fawb Hauv Xeev (Kev Ntsuas Ua Haujlwm)
Kev Ntsuas: Tom qab 30 feeb ntawm lub zog- ntawm kev ua haujlwm kom txog thaum thermal sib npaug, ntsuas qhov rwb thaiv tsev tsis pub dhau 2 vib nas this ntawm lub zog- tawm.
Pass / Fail Standard: Ntau dua lossis sib npaug rau 200 MΩ (500V DC);
Kev Ceeb Toom Tsis Txaus Siab: Yog tias qhov ntsuas txias - lub xeev qhov ntsuas tau dhau los (Ntau dua lossis sib npaug li 500 MΩ) tab sis qhov kub - lub xeev kev sim qhia pom tias poob qis hauv qhov tsis kam, nws qhia tau tias tsis tiav sintering ua rau micropore o thiab xau txoj hauv kev ntawm qhov kub thiab txias.
Qhov no yog ib txoj hauv kev ua haujlwm tsis ncaj tab sis tseem ceeb heev, tshwj xeeb tshaj yog tsim rau ua ntej - ntim cov khoom tiav.
3. X-Ray Inspection (Tsis yog-Kev kuaj kab mob puas tsuaj)
Cov Ntsiab Lus Tshawb Fawb: Tshawb xyuas qhov tsis xws luag xws li voids, tawm -cov cores hauv nruab nrab, thiab qhov ntom ntom tsis sib xws hauv cheeb tsam.
Resolution Requirement: Ntau dua lossis sib npaug li 5μm, muaj peev xwm txheeb xyuas micron - theem kev tsis sib xws.
Kev Txiav Txim Siab: Yog tias pom muaj qhov xoob xoob hauv zos lossis qhov porosity siab, nws qhia tias tsis txaus ua ntej sintering lossis tsis ua kom muaj qhov ntom ntom thaum lub sijhawm sintering.
Qhov no tuaj yeem ua ntxiv rau kev tshuaj ntsuam metallographic rau tsis yog -kev tshuaj ntsuam ua ntej kev puas tsuaj.
Daim Ntawv Txiav Txim Siab Zoo
Cov khoom xeem: Ua kom tiav Sintering / Tsis tiav Sintering
Metallographic Analysis: Cov qoob loo loj hlob, ntom ntom thiab nruam / xoob hmoov, tsis muaj recrystallization
Kub rwb thaiv tsev Resistance: Ntau tshaj los yog sib npaug rau 200 MΩ /<200 MΩ, even approaching 0
X-Ray Inspection: Uniform filling, tsis muaj voids / Localized looseness lossis porosity muaj
Rework Recommendation: Tsis xav tau resintering / Yuav tsum tau re-sintered
Hauv kev xyaum, kev sib xyaw ntawm metallographic tsom xam thiab kev ntsuas kub tuaj yeem txiav txim siab qhov tseeb ntawm sintering nrog ntau dua 95% qhov tseeb.
